BOM Risk Notes
Confirm lifecycle status, required quantity, destination country, and acceptable alternates before locking the order.
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Semiconductors
IPB031N08N5ATMA1
特性：适用于高频开关和同步整流。 出色的栅极电荷 × 导通电阻乘积（FOM）。 极低的导通电阻 RDS(on)。 N 沟道，正常电平。 100% 雪崩测试。 无铅镀层；符合 RoHS 标准。 根据 JEDEC 针对目标应用进行认证。 根据 IEC61249-2-21 标准无卤
Applications and Features
Primary Features
- Package: TO-263-3
- Packaging: N/A
- RoHS: Not compliant
Typical Applications
- Semiconductors related design scenarios
Product Overview
适用于高频开关和同步整流。 具有出色的栅极电荷 x RDS(on) 乘积(品质因数) 极低的导通电阻 RDS(on) N 沟道,标准电平 经过 100% 雪崩测试 无铅镀层;符合 RoHS 标准 符合 JEDEC 针对目标应用的认证 符合 IEC61249-2-21 标准的无卤要求
Procurement Notes
Use this page as a sourcing reference. Final availability, MOQ, lead time, and compliance assumptions should be confirmed through RFQ before ordering this part.
Substitute Selection Notes
When the original MPN is constrained, compare package, ratings, tolerance, temperature range, and compliance status before approving an alternate.
Typical Use Cases
Suitable for BOM review, maintenance sourcing, prototype replenishment, production-gap purchasing, and alternative-part screening.
Full Parameter Table
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